Introduction Test the ability of the device to withstand high temperature, low temperature, cold and hot shock environment Method Constant temperature and variable temperature working state detection, constant temperature and variable temperature non-working state detection Standard AS6081, AS9120 Apply to Military devices, chips used in harsh environments
Introduction Test pin's ability to reliably weld to PCB Method Solder tank balance method, weighing method Standard AS6081, AS9120 Apply to Analysis of failure caused by poor solder of components
Introduction Test whether various chemical elements meet international standards Method Ion chromatography, ion selective electrode, atomic absorption Standard RoHS(2011/65/EU) Apply to Test whether components and materials meet environmental requirements and relevant international standards
Introduction Check whether the component pin is consistent with the datasheet Method Test leads PN junction electrical characteristic parameters Standard AS6081, AS9120 Apply to Check whether components are substitutes or counterfeits.
Introduction Through the test, confirm the marking status of the device Method Acetone reagent wipe test Standard AS6081, AS9120 Apply to Test whether the device is polished and remarked, black-topped
Introduction Check whether the marking, main body and leads of components meet the standard Method Microscope Standard AS6081, AS9120 Apply to Suspect that the parts are refurbished and have Strict requirements for the visual inspection of chips
Introduction To verify the device logo , part number, design time, bonding lines, and others Method Chemical method Standard AS6081, AS9120 Apply to Unable to determine the chip manufacturer and part number, chip failure analysis, wafer surface circuit analysis, etc
Introduction Without damaging the chip, detect the packaging of components, such as bubbles, abnormal bond line, die size, bracket direction, etc Method X-Ray fluoroscopy, multi - direction and angle optional Standard AS6081, AS9120 Apply to Check whether there is any abnormality in bondlines, whether there is any defect in package, confirm die size and layout
