Introduction
Test pin’s ability to reliably weld to PCB
Method
Solder tank balance method, weighing method
Standard
AS6081, AS9120
Apply to
Analysis of failure caused by poor solder of components
Related Posts
Decap
Introduction To verify the device logo , part number, design time, bonding lines, and others Method Chemical method Standard AS6081, AS9120 Apply to Unable... read more
Authenticity Test
Introduction Verify whether the components are original factory and original materials Method Visual inspection + Decap + Datasheet verify +... read more
X-Ray Test
Introduction Without damaging the chip, detect the packaging of components, such as bubbles, abnormal bond line, die size,... read more
Microwave Chip testing
Introduction Verify the high frequency characteristics of microwave chip according to specifications Method In the laboratory simulate chip the real... read more
IGBT Test
Introduction Verify the parameters of IGBT according to the specification Method To build IGBT drive circuit, special high-power drive circuit... read more
Acetone Test
Introduction Through the test, confirm the marking status of the device Method Acetone reagent wipe test Standard AS6081, AS9120 Apply to Test whether the... read more
Reliability Test
Introduction Test the ability of the device to withstand high temperature, low temperature, cold and hot shock environment Method Constant... read more
Electrical Test
Introduction Test the electrical performance parameters of components in non-working state, including pin open circuit test, pin short... read more
RoHS Test
Introduction Test whether various chemical elements meet international standards Method Ion chromatography, ion selective electrode, atomic absorption Standard RoHS(2011/65/EU) Apply to Test whether components... read more
Failure Analysis
Introduction Analyze the failure cause of the failed sample Method A comprehensive analysis method combining multiple detection techniques Standard Datasheet Apply to Understand the... read more
