Introduction
Test pin’s ability to reliably weld to PCB
Method
Solder tank balance method, weighing method
Standard
AS6081, AS9120
Apply to
Analysis of failure caused by poor solder of components


Introduction
Test pin’s ability to reliably weld to PCB
Method
Solder tank balance method, weighing method
Standard
AS6081, AS9120
Apply to
Analysis of failure caused by poor solder of components


Introduction To verify the device logo , part number, design time, bonding lines, and others Method Chemical method Standard AS6081, AS9120 Apply to Unable... read more
Introduction Program, verify, Erase, burn procedures, blank check, one-time device check Method Programmer Standard Datasheet Apply to PROM, EPROM,EEPROM,FLASH,MCU read more
Introduction Verify the functions of components according to specifications Method In the laboratory simulate chip the real working state, lap... read more
Introduction The device is baked at high temperature and vacuum-packed according to the requirements of humidity sensitivity level Method Put... read more
Introduction Check whether the marking, main body and leads of components meet the standard Method Microscope Standard AS6081, AS9120 Apply to Suspect that the... read more
Introduction Through the test, confirm the marking status of the device Method Acetone reagent wipe test Standard AS6081, AS9120 Apply to Test whether the... read more
Introduction Verify the parameters of IGBT according to the specification Method To build IGBT drive circuit, special high-power drive circuit... read more
Introduction Test the ability of the device to withstand high temperature, low temperature, cold and hot shock environment Method Constant... read more
Introduction Analyze the failure cause of the failed sample Method A comprehensive analysis method combining multiple detection techniques Standard Datasheet Apply to Understand the... read more
Introduction Without damaging the chip, detect the packaging of components, such as bubbles, abnormal bond line, die size,... read more
