Visual Inspection

Introduction The device is baked at high temperature and vacuum-packed according to the requirements of humidity sensitivity level Method Put... read more

Introduction Verify whether the components are original factory and original materials Method Visual inspection + Decap + Datasheet verify +... read more

Introduction Verify the functions of components according to specifications Method In the laboratory simulate chip the real working state, lap... read more

Introduction To verify the device logo , part number, design time, bonding lines, and others Method Chemical method Standard AS6081, AS9120 Apply to Unable... read more

Introduction Without damaging the chip, detect the packaging of components, such as bubbles, abnormal bond line, die size,... read more

Introduction Program, verify, Erase, burn procedures, blank check, one-time device check Method Programmer Standard Datasheet Apply to PROM, EPROM,EEPROM,FLASH,MCU read more

Introduction Analyze the failure cause of the failed sample Method A comprehensive analysis method combining multiple detection techniques Standard Datasheet Apply to Understand the... read more

Introduction Test the ability of the device to withstand high temperature, low temperature, cold and hot shock environment Method Constant... read more

Introduction Test the electrical performance parameters of components in non-working state, including pin open circuit test, pin short... read more

Introduction Check whether the component pin is consistent with the datasheet Method Test leads PN junction electrical characteristic parameters Standard AS6081, AS9120 Apply... read more